BCL603S

BCL603S1P is a high-performance and ultra-low power consumption Chiplet dedicated chip for smart rings. It adopts a 4mm wide LGA package form. Smart rings can be designed with a two-layer board FPC, reducing the BOM number by 30% and ensuring a yield of over 95% when bending PCBA. It provides a dedicated communication protocol and algorithm library for smart rings. Support secondary development and customized protocol development. The specific product features are as follows:

• It integrates more than 20 devices such as BLE chips, LDO, PMIC and resistors

• Working voltage: 2.0V to 3.6V

• It can provide up to 19 GPIO ports, 2 I2C channels, 2 SPI channels, and support the mounting of PPG, NTC, IMU, NFC, LED and other peripherals and sensors

• Support BLE 5.2, embed the low-power Bluetooth protocol stack and GATT service

• It is embedded with the smart ring firmware and supports connection and use with the ChipletRing App

• The ARM Cortex-M0 32-bit core has a main frequency of up to 64MHz and a CPU operating power consumption of 60uA/MHz

• It has 64KB of SRAM, among which the Bluetooth protocol stack occupies 20KB, and supports the operation of various algorithms such as heart rate, blood oxygen, blood pressure, sleep, step counting, and 3DoF

• With 512KB of Flash, historical record data can be retained for more than 7 days

• Transmission power: -20 DBM to +4dBm

• High receiving sensitivity: -96 DBM

• The peak current for transmission and reception is less than 4.6mA

• The dormant current is less than 1µA

• The broadcast status current of the ring at 1-second intervals is less than 130uA

• The state current for blood oxygen measurement is less than 1.8mA

• The ring can last for more than five days

• Operating temperature range: -40℃ to 80℃

BCL602S2L is a high-performance, ultra-low power dedicated chip for smart ring Chiplet. It adopts 5×5 LGA package form. The smart ring can adopt two-layer FPC design, the BOM number is reduced by 30%, the yield of PCBA when bending is more than 95%, and the communication protocol and calculation library for smart ring are provided. Support secondary development and custom protocol development. The product features are as follows：

• Integrates more than 20 devices such as NRF52832, crystal oscillator, resistance and capacitance, PMIC, etc

• Operating voltage: 1.7V~3.6V

• provides up to 16 GPIO ports, which can be configured as 2-way I²C, 3-way SPI, 8-channel 12bit ADC, supporting PPG, NTC, G-Sensor, LED and other peripherals and sensors

• supports BLE 5.2, embedded Bluetooth Low Energy stack, and GATT services

• embedded smart ring firmware, support ChipletRing App connection use

• ARM Cortex-M4 32-bit with floating-point computing core, the CPU can reach 64MHz and the CPU power consumption is 58uA/MHz

• 64KB SRAM, 512K ROM, of which the Bluetooth protocol stack occupies 20KB, supports various algorithms such as heart rate, blood oxygen, blood pressure, sleep, and step counting

• 512KB Flash, historical data can be reserved for more than 7 days

• Transmit power: -20 DBM ~ +4dBm

• Receiving sensitivity: -96dBm

• TX RX Peak current < 5.4mA(0dBm)

• Ring resting current < 0.6µA

• The ring broadcast status current <80uA at 1s interval

• Ring heart rate oximetry current <1.8mA

• Ring battery life can be more than 7 days

• Operating temperature range: -40℃~80℃

BCL602S2P is a high-performance, ultra-low power dedicated chip for smart ring Chiplet, using 4mm width LGA package, smart ring can adopt two-layer FPC design, reduce BOM number by 30%, ensure PCBA bending yield of more than 95%, provide smart ring dedicated communication protocol and algorithm library. Support secondary development and custom protocol development, The product features are as follows:

• Integrates more than 20 devices such as NRF52840, LDO, PMIC, crystal oscillator, resistance,capacitance, etc

• Operating voltage: 1.7V~5.5V

• provides up to 19 GPIO ports, which can be configured as 2-channel I²C, 4-channel SPI, 8-channel 12bit ADC, supporting PPG, NTC, IMU, ECG, NFC, LED and other peripherals and sensors

• Built-in NFC supports touch-and-click pairing

• supports BLE 5.2, embedded Bluetooth Low Energy stack, and GATT services

• embedded smart ring firmware, support ChipletRing App connection use

• ARM Cortex-M4 32-bit provides a floating-point computing core, a CPU frequency of up to 64MHz, and a CPU power consumption of 52uA/MHz

• 256KB SRAM, of which the Bluetooth protocol stack occupies 20KB, supports the operation of various algorithms such as heart rate, blood oxygen, blood pressure, sleep, step counting, and 3DoF

• 1MB Flash. Historical data can be retained for more than 7 days. Dual-backup OTA upgrade is supported

• Transmit power: -20 DBM ~ +8dBm

• High receiving sensitivity: -96dBm

• TX RX Peak current < 4.8mA(0dBm)

• Ring resting current < 0.6µA

• The ring broadcast status current <80uA at 1s interval

• Ring heart rate oximetry current <1.6mA

• Ring battery life can be more than 7 days

• Operating temperature range: -40℃~80℃

BCL603S3L is a high-performance, ultra-low power dedicated chip for smart ring Chiplet. It adopts 4mm width LGA package form. Smart ring can adopt two-layer FPC design, reduce BOM quantity by 30%, ensure the yield of PCBA can reach 95% or more when bending, and provide special communication protocol and calculation library for smart ring. Support secondary development and custom protocol development. The product features are as follows：

• Integrates more than 20 devices such as Apollo3 blue, LDO, crystal oscillator, resistance and capacitance

• Working voltage: 1.755V~3.63V

• can provide up to 20 GPIO ports, including 2 I²C, 3 SPI, 14bit ADC, PPG, NTC, IMU, ECG, NFC, LED and other peripherals and sensors

• supports BLE 5.2, embedded Bluetooth Low Energy stack, and GATT services

• ARM Cortex-M4 32bit with floating point computing core, the main frequency up to 96MHz

• SPOT technology, the CPU power consumption is 6uA/MHz

• 384KB SRAM, 1M ROM, of which the Bluetooth protocol stack occupies 20KB, supports various algorithms such as heart rate, blood oxygen, blood pressure, sleep, step counting, and 3DoF

• 1MB Flash. Historical data can be retained for more than 7 days. Dual-backup OTA upgrade is supported

• Transmit power: -20 DBM ~ +4dBm

• High receiving sensitivity: -94dBm

• TX RX Peak current < 3mA(0dBm)

• Ring resting current < 0.6µA

• Ring broadcast status current <50uA at 1s interval

• Ring heart rate oximetry current <1.6mA

• Ring battery life can be more than 7 days

• Operating temperature range: -40℃~85℃

BCL603S4 is a high-performance and ultra-low power consumption Chiplet dedicated chip for smart rings. It adopts a 5mm wide LGA package form. Smart rings can be designed with a two-layer board FPC, reducing the BOM number by 30% and ensuring a yield of over 95% when bending PCBA. It provides a dedicated communication protocol and algorithm library for smart rings. Support secondary development and customized protocol development. The specific product features are as follows:

• It integrates over 20 devices such as OM6621PB1A1, LDO, PMIC, crystal oscillator, resistance-capacitance, etc

• Operating voltage: 1.7V to 5.5V

• It can provide up to 19 GPIO ports, which can be configured as 2 I2C channels, 4 SPI channels, 8-channel 12-bit ADC, and support the mounting of PPG, NTC, IMU, ECG, NFC, LED and other peripherals and sensors

• It is equipped with NFC and supports tap-to-pair functionality

• Support BLE 5.2, embed the low-power Bluetooth protocol stack and GATT service

• It is embedded with the smart ring firmware and supports connection and use with the ChipletRing App

• The ARM Cortex-M4F core has a main frequency of up to 128MHz and a CPU operating power consumption of 52uA/MHz

• It has 392KB of SRAM, among which the Bluetooth protocol stack occupies 20KB, and supports the operation of various algorithms such as heart rate, blood oxygen, blood pressure, sleep, step counting, and 3DoF

• 8Mb Flash, historical record data can be retained for more than 7 days, and dual backup OTA upgrade is supported

• Transmission power: -20 DBM to +8dBm

• High receiving sensitivity: -96 DBM

• The peak current of TX RX is < 4.8mA(0dBm)

• The current in the dormant state of the ring is less than 0.6µA

• The broadcast status current of the ring at 1-second intervals is less than 80uA

• The state current of the ring heart rate and blood oxygen measurement is less than 1.6mA

• The ring can last for more than 7 days

• Operating temperature range: -40℃ to 80℃

BCL603S5 is a high-performance and ultra-low power consumption Chiplet dedicated chip for smart rings. It adopts a 4mm wide LGA package form. Smart rings can be designed with a two-layer board FPC, reducing the BOM number by 30% and ensuring a yield of over 95% when bending PCBA. It provides a dedicated communication protocol and algorithm library for smart rings. Support secondary development and customized protocol development. The specific product features are as follows:

• It integrates over 20 devices such as GR5515GGBD, LDO, PMIC, crystal oscillator, resistance-capacitance, etc

• Operating voltage: 1.7V to 3.8V

• It can provide up to 23 GPIO ports, which can be configured as 2 I2C ports, 2 SPI ports, 2 QSPI ports, and an 8-channel 13-bit ADC. It supports mounting peripherals and sensors such as PPG, NTC, IMU, ECG, NFC, and LED

• Support BLE 5.1, embed the low-power Bluetooth protocol stack and GATT service

• It is embedded with the smart ring firmware and supports connection and use with the ChipletRing App

• The ARM Cortex-M4F core has a main frequency of up to 64MHz and a CPU operating power consumption of 30uA/MHz

• 256KB RAM and 1MB ROM support the operation of multiple algorithms such as heart rate, blood oxygen, blood pressure, sleep, step counting, and 3DoF

• 1MB Flash, historical record data can be retained for more than 7 days, and dual backup OTA upgrade is supported

• Transmission power: -20 DBM to +7dBm

• High receiving sensitivity: -97 DBM

• TX current: 3.05 mA@0dBm, 1Mbps

• RX current: 3.9mA@1Mbps

• Operating temperature range: -40℃ to 85℃

• The current in the dormant state of the ring is less than 0.6µA

• The broadcast status current of the ring at 1-second intervals is less than 80uA

• The state current of the ring heart rate and blood oxygen measurement is less than 1.6mA

• The battery life of the ring can be 5 to 9 days

• Operating temperature range: -40℃ to 80℃